- Sat May 02, 2015 6:32 am
#16278
As the ESP modules sends out RF bursts, they will draw bursts of current pulses from the supply. In order to ensure stable operation, it is recommended to place a 10-100nF decoupling capacitor as close as possible to the module supply terminals, with as short leads as possible. I recommend ceramic type capa, having a good high frequency response. If the environment is very noisy, or the power supply used close to its rating (not recommended) a larger (10-100 µF) electrolytic capa should be included on the PCB near by. Electrolytic capas are slower than the ceramic, but holds larger charge, and serve the purpose as low frequency current buffer.
Below is an example of an ESP-01 with a ceramic capa directly on the ESP module. It is a good idea to plug all the module pins into a socket while soldering, the socket will then serve as thermal shunt - helping to avoid the ESP pins from getting displaced when it gets hot. Finally, it is a good idea to cover this by a glob of e.g. hot-melt glue to fix and insulate.
Below is an example of an ESP-01 with a ceramic capa directly on the ESP module. It is a good idea to plug all the module pins into a socket while soldering, the socket will then serve as thermal shunt - helping to avoid the ESP pins from getting displaced when it gets hot. Finally, it is a good idea to cover this by a glob of e.g. hot-melt glue to fix and insulate.
